Capacitance Change by Thermal Expansionexamples|products|Murata Software Co., Ltd.

Example2 Capacitance Change by Thermal Expansion

General

  • Capacitance change of a capacitor by thermal expansion is analyzed.
     

  • [Analysis with deformed shape taken into consideration] is used.

  • Unless specified in the list below, the default conditions will be applied.
     

 

 

Three analysis models are prepared.

 

・Before deformation (electric field analysis)

・Deformed shape (mechanical stress analysis)

・After deformation (electric field analysis)

 

See [Analysis with the Deformed Shape Taken into Account] for more information.

 

Analysis Model 1: Before Deformation

Set up analysis before the deformation. The model is named [Before deformation].

Analysis Space

Item

Setting

Analysis Space

3D

Model unit

mm

 

Analysis Condition

Item

Setting

Solver

Electric field analysis [Coulomb]

Analysis Type

Static analysis (capacitance)

Options

None

 

In actuality, the electric field exists outside the analysis domain. Therefore the open boundary condition below is applied initially.

Tab

Setting Item

Setting

Open Boundary Tab

Type

Absorbing boundary

Order of Absorbing Boundary

1st degree

Graphical Object

Create a cubic solid body for a dielectric (Block).

Create the voltage-setting places by the sheet bodies to set the voltage boundary condition on the top and bottom faces of the dielectric.

Body Attributes and Materials

Body Number/Type

Body Attribute Name

Material Name

0/Solid

Block

001_Alumina *

1/Sheet

None (imprinting body)

2/Sheet

None (imprinting body)

* Available from the material DB

Boundary Condition

Boundary Condition Name/Topology

Tab

Boundary Condition Type

Setting

V0/Face

Electric

Electric wall

Voltage specified, 1[V]

V1/Face

Electric

Electric wall

Voltage specified, 0[V]

Outer Boundary Condition *

Electric

Open Boundary

Set up on the open boundary tab.

To set Outer Boundary Condition, go to the [Model] tab
 


 

and click [Outer Boundary Condition] .

Analysis Model 2: Deformed Shape Calculation

Set the mechanical stress analysis to calculate the deformation caused by the thermal expansion.

Copy Analysis Model 1 (before deformation) and set up as follows. The model is named [Deformed shape calculation].

See [Copy Analysis Model into Project] for the details.

Analysis Condition

Item

Setting

Solver

Mechanical stress analysis [Galileo]

Analysis Type

Static Analysis

Options

Thermal Load

 

Tab

Setting Item

Setting

Step/Thermal Load

Step Setting

Thermal load analysis

Reference temperature

25[deg]

Reached Temperature

200[deg]

Analysis Model 3: After Deformation

Set up the analysis that takes the deformed shape into account.

Copy Analysis Model 1 (before deformation) and set up as follows. The model is named [After deformation].

See [Copy Analysis Model into Project] for the details.

Analysis Condition

Specify Analysis Model 2 (Deformation shape calculation) on the result import tab.

 

Tab

Setting Item

Setting

Result Import

Import Type

Deformed shape

Specify Results

Specify Analysis Model [Deformed Shape Calculation]

 

Run Mesher/Solver

Run the solver with all analysis models. Calculation of Analysis Model 2 (deformed shape) must be completed before going on to Analysis Model 3 (after deformation).

Results

To see the calculation results, go to the [Results] tab

 

 

 and click [Table] .

 

Results of Analysis Model 1 (before deformation) are as follows.

 

The capacitance of C1-2 is 0.884[pF].

 

A displacement diagram of Analysis Model 2 (deformed shape calculation) is shown as below.

The expansion due to the temperature change is observed.

 

Results of Analysis Model 3 (After deformation) are as follows.

 

 

The capacitance of C1-2 is 0.892[pF]. It confirms that the capacitance is increased due to the deformation.