Home / Examples / Coupled Analysis / Thermal-Stress Analysis [Watt/Galileo] / Example 1: Deformation due to the Temperature Gradient #1 - Single Material

Example 1: Deformation due to the Temperature Gradient #1 - Single Material

The deformation due to the temperature gradient on a singe-material cube is analyzed.
The temperature distribution is solved in the thermal analysis (Watt) and it can be treated as a reached temperature for a thermal load.
The stress is solved with the thermal load taken into account in the stress analysis (Galileo).
The deformation, the displacement distribution, and the stress distribution are solved.
Unless specified in the list below, the default conditions will be applied.
Obtain this session's project file. (Right-click and choose 'Save link as')

Select Thermal analysis and Stress analysis.

Item	Settings
Solver	Thermal Analysis [Watt] Stress Analysis [Galileo]
Thermal-Analysis Type	Steady-State Analysis
Options	N/A *

* [Thermal Load] is selected by default for the thermal-stress coupled analysis.

The Step/Thermal Load tab is set as follows.

Tab	Setting Item	Settings
Step/Thermal Load *	Reference Temperature	0 [deg]

* The reached temperatures come from the thermal analysis.

The model is a cubic solid body. The material is the polycarbonate. The temperature is fixed at the top and bottom faces.

Body Number/Type	Body Attribute Name	Material Name
0/Solid	CUBIC	002_Polycarbonate(PC) *

* Available from the material DB

Thermal analysis is performed based on the boundary conditions below. The resulting temperature distribution is forwarded to stress analysis.

Boundary Condition Name/Topology	Tab	Boundary Condition Type	Settings
100degree/Face	Thermal	Temperature	100 [deg]
0degree/Face	Thermal	Temperature	0 [deg]

The temperature distribution as a result of Watt is shown below.

The next figure shows the vectors of displacement as a result of Galileo following Watt.

The expansion is larger at the top of the model.