{"text_format":"1","workbook":"xlsx","n_sheets":5,"sheets":["実行シート","読込データ","結合後データ","熱流","熱抵抗"],"not_rendered":{"charts":0,"images":0,"macros":1,"external_links":0,"defined_names":0,"comments":1,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900"}

{"sheet":"実行シート","index":0,"n_rows":36,"n_cols":11,"rows_kept":36,"cut":false,"hidden":false,"merged":[]}
[]
[]
[]
[]
[]
[]
[null,null,null,null,null,null,null,"読み込みファイル形式","csv","読み込んだファイル名","model_1_heatflow.csv"]
[null,null,null,null,null,null,null,"ノードの種類","ボディ属性"]
[]
[]
[]
[]
[null,null,null,null,null,null,null,"熱流表示の下限値(W)",0]
[null,null,null,null,null,null,null,"熱流表示の太さの最大値(pt)",20]
[null,null,null,null,null,null,null,"孤立ノードの表示","非表示"]
[null,null,null,null,null,null,null,"表示幅","スリム"]
[null,null,null,null,null,null,null,"背景色","白"]
[null,null,null,null,null,null,null,"温度スケール","自動"]
[null,null,null,null,null,null,null,"最大温度(℃)",100]
[null,null,null,null,null,null,null,"最小温度(℃)",0]
[]
[null,null,null,null,null,null,null,"可視化前にノード結合","行わない"]
[null,null,null,null,null,null,null,"結合方法","手動"]
[null,null,null,null,null,null,null,"結合判定温度差（℃）",1]
[]
[null,null,null,null,null,null,null,"手動結合リスト"]
[null,null,null,null,null,null,null,"ノード数",8]
[null,null,null,null,null,null,null,"ノード名","結合番号"]
[null,null,null,null,null,null,null,"CHIP"]
[null,null,null,null,null,null,null,"INTERPOSER_LAYER"]
[null,null,null,null,null,null,null,"INTERPOSER"]
[null,null,null,null,null,null,null,"MOLD"]
[null,null,null,null,null,null,null,"SOLDER_LAYER"]
[null,null,null,null,null,null,null,"JUNCTION"]
[null,null,null,null,null,null,null,"BOARD_LAYER"]
[null,null,null,null,null,null,null,"BOARD"]

{"sheet":"読込データ","index":1,"n_rows":37,"n_cols":15,"rows_kept":37,"cut":false,"hidden":true,"merged":[]}
["File_Ver","Ver01","Femtet_2019.1"]
["ボディ属性数",8]
["環境列数",3]
["その他列数",2]
[]
["ボディ属性間熱流量"]
["","CHIP","INTERPOSER_LAYER","INTERPOSER","MOLD","SOLDER_LAYER","JUNCTION","BOARD_LAYER","BOARD","環境[対流]","環境[輻射]","環境[熱伝達]","その他[温度境界]","その他[熱流束境界]","発熱"]
["CHIP",0,1.9062330000000001,0,3.0263700000000001E-2,0,-1.936496,0,0,0,0,0,0,0,0]
["INTERPOSER_LAYER",-1.9062330000000001,0,5.7951580000000003E-2,0.10174279999999999,1.680366,0,0,0,3.4392850000000003E-2,3.1779250000000002E-2,0,0,0,0]
["INTERPOSER",0,-5.7951580000000003E-2,0,-1.6134809999999999E-2,0,0,0,0,5.1050209999999999E-2,2.3036190000000002E-2,0,0,0,0]
["MOLD",-3.0263700000000001E-2,-0.10174279999999999,1.6134809999999999E-2,0,0,-6.3503690000000002E-2,0,0,0.1020993,7.7276120000000004E-2,0,0,0,0]
["SOLDER_LAYER",0,-1.680366,0,0,0,0,1.6762220000000001,0,3.4034339999999999E-3,7.4075460000000003E-4,0,0,0,0]
["JUNCTION",1.936496,0,0,6.3503690000000002E-2,0,0,0,0,0,0,0,0,0,2]
["BOARD_LAYER",0,0,0,0,-1.6762220000000001,0,0,0.12931390000000001,0.60633119999999996,0.94057679999999999,0,0,0,0]
["BOARD",0,0,0,0,0,0,-0.12931390000000001,0,8.9476589999999995E-2,3.9837329999999997E-2,0,0,0,0]
[]
["ボディ属性間熱抵抗"]
["","CHIP","INTERPOSER_LAYER","INTERPOSER","MOLD","SOLDER_LAYER","JUNCTION","BOARD_LAYER","BOARD","環境[対流]","環境[輻射]","環境[熱伝達]"]
["CHIP","INF",5.4737229999999997,"INF",292.70569999999998,"INF",1.8598159999999999E-2,"INF","INF","INF","INF","INF"]
["INTERPOSER_LAYER",5.4737229999999997,"INF",1.734899,-15.48837,0.86743079999999995,"INF","INF","INF",378.26690000000002,409.37639999999999,"INF"]
["INTERPOSER","INF",1.734899,"INF",103.8977,"INF","INF","INF","INF",252.87139999999999,560.38509999999997,"INF"]
["MOLD",292.70569999999998,-15.48837,103.8977,"INF","INF",140.0607,"INF","INF",142.8561,188.74529999999999,"INF"]
["SOLDER_LAYER","INF",0.86743079999999995,"INF","INF","INF","INF",1.789412,"INF",3394.241,15595.01,"INF"]
["JUNCTION",1.8598159999999999E-2,"INF","INF",140.0607,"INF","INF","INF","INF","INF","INF","INF"]
["BOARD_LAYER","INF","INF","INF","INF",1.789412,"INF","INF",0.1570801,14.10553,9.0929559999999992,"INF"]
["BOARD","INF","INF","INF","INF","INF","INF",0.1570801,"INF",95.358019999999996,214.1788,"INF"]
[]
["温度"]
["","平均温度","環境温度の数","環境温度"]
["CHIP",48.443860000000001,0,-300]
["INTERPOSER_LAYER",38.009680000000003,1,25]
["INTERPOSER",37.909140000000001,1,25]
["MOLD",39.585509999999999,1,25]
["SOLDER_LAYER",36.552070000000001,1,25]
["JUNCTION",48.479880000000001,0,-300]
["BOARD_LAYER",33.552619999999997,1,25]
["BOARD",33.532310000000003,1,25]

{"sheet":"結合後データ","index":2,"n_rows":37,"n_cols":15,"rows_kept":37,"cut":false,"hidden":true,"merged":[]}
["File_Ver","Ver01","Femtet_2019.1"]
["ボディ属性数",8]
["環境列数",3]
["その他列数",2]
[]
["ボディ属性間熱流量"]
["","CHIP","INTERPOSER_LAYER","INTERPOSER","MOLD","SOLDER_LAYER","JUNCTION","BOARD_LAYER","BOARD","環境[対流]","環境[輻射]","環境[熱伝達]","その他[温度境界]","その他[熱流束境界]","発熱"]
["CHIP",0,1.9062330000000001,0,3.0263700000000001E-2,0,-1.936496,0,0,0,0,0,0,0,0]
["INTERPOSER_LAYER",-1.9062330000000001,0,5.7951580000000003E-2,0.10174279999999999,1.680366,0,0,0,3.4392850000000003E-2,3.1779250000000002E-2,0,0,0,0]
["INTERPOSER",0,-5.7951580000000003E-2,0,-1.6134809999999999E-2,0,0,0,0,5.1050209999999999E-2,2.3036190000000002E-2,0,0,0,0]
["MOLD",-3.0263700000000001E-2,-0.10174279999999999,1.6134809999999999E-2,0,0,-6.3503690000000002E-2,0,0,0.1020993,7.7276120000000004E-2,0,0,0,0]
["SOLDER_LAYER",0,-1.680366,0,0,0,0,1.6762220000000001,0,3.4034339999999999E-3,7.4075460000000003E-4,0,0,0,0]
["JUNCTION",1.936496,0,0,6.3503690000000002E-2,0,0,0,0,0,0,0,0,0,2]
["BOARD_LAYER",0,0,0,0,-1.6762220000000001,0,0,0.12931390000000001,0.60633119999999996,0.94057679999999999,0,0,0,0]
["BOARD",0,0,0,0,0,0,-0.12931390000000001,0,8.9476589999999995E-2,3.9837329999999997E-2,0,0,0,0]
[]
["ボディ属性間熱抵抗"]
["","CHIP","INTERPOSER_LAYER","INTERPOSER","MOLD","SOLDER_LAYER","JUNCTION","BOARD_LAYER","BOARD","環境[対流]","環境[輻射]","環境[熱伝達]"]
["CHIP","INF",5.4737229999999997,"INF",292.70569999999998,"INF",1.8598159999999999E-2,"INF","INF","INF","INF","INF"]
["INTERPOSER_LAYER",5.4737229999999997,"INF",1.734899,-15.48837,0.86743079999999995,"INF","INF","INF",378.26690000000002,409.37639999999999,"INF"]
["INTERPOSER","INF",1.734899,"INF",103.8977,"INF","INF","INF","INF",252.87139999999999,560.38509999999997,"INF"]
["MOLD",292.70569999999998,-15.48837,103.8977,"INF","INF",140.0607,"INF","INF",142.8561,188.74529999999999,"INF"]
["SOLDER_LAYER","INF",0.86743079999999995,"INF","INF","INF","INF",1.789412,"INF",3394.241,15595.01,"INF"]
["JUNCTION",1.8598159999999999E-2,"INF","INF",140.0607,"INF","INF","INF","INF","INF","INF","INF"]
["BOARD_LAYER","INF","INF","INF","INF",1.789412,"INF","INF",0.1570801,14.10553,9.0929559999999992,"INF"]
["BOARD","INF","INF","INF","INF","INF","INF",0.1570801,"INF",95.358019999999996,214.1788,"INF"]
[]
["温度"]
["","平均温度","環境温度の数","環境温度"]
["CHIP",48.443860000000001,0,-300]
["INTERPOSER_LAYER",38.009680000000003,1,25]
["INTERPOSER",37.909140000000001,1,25]
["MOLD",39.585509999999999,1,25]
["SOLDER_LAYER",36.552070000000001,1,25]
["JUNCTION",48.479880000000001,0,-300]
["BOARD_LAYER",33.552619999999997,1,25]
["BOARD",33.532310000000003,1,25]

{"sheet":"熱流","index":3,"n_rows":0,"n_cols":0,"rows_kept":0,"cut":false,"hidden":false,"merged":[]}

{"sheet":"熱抵抗","index":4,"n_rows":0,"n_cols":0,"rows_kept":0,"cut":false,"hidden":false,"merged":[]}