| General | A module is greatly bent by heat in some cases. Simulation helps you to find the better location of the components, select proper resin, and eventually, reduce the problems in the manufacturing process. |
|---|---|
| Analysis Model | In this analysis, the temperature profile , which is used for soldering of the components and curing of the resin, is divided to substeps. |
| Result | A birth/death function is available to take into account the effect of the melted solder at high temperature and curing of the resin. |
| Keywords | Component Mounting,Resin Curing,Melting,Cure Shrinkage,Initial Strain,Birth,Multi-Stage Thermal Load Analysis |
Simulation and Measurement
