| General | In the reflow soldering, it is necessary to raise the temperature higher than the melting point of solder at the soldering point. On the other hand, it is required to suppress thermal damage on the components and substrate. So, setting a suitable temperature profile is important. By utilizing simulation, proper setting can be examined before the trial run. |
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| Analysis Model | |
| Result | Temperature distribution of an object in the reflow soldering is analyzed. |
| Keywords | Reflow,Solder |
Fig. 1: Analysis Model
Chart 1: Reflow Solder Setup
Fig. 2: Flow Velocity Vectors
Fig. 3: Flow Velocity Contour
Fig. 4: Temperature Contour
Fig. 5: Temperature Change
