| General | A module was mounted on the evaluation board. |
|---|---|
| Analysis Model | The mechanical stress on the top and bottom sides was simulated in the transient analysis. |
| Result | The large stress was found at one of the four corners. |
| Keywords | Drop Analysis,Transient Stress Analysis,Drop Test,Stress Concentration,Solder Stress |
Fig. 1 Analysis Model
Fig. 2 Result
