| General | A device, which consists of elements and substrate packaged with resin, was analyzed. |
|---|---|
| Analysis Model | A thermal load analysis was conducted assuming the temperature was increased from 20 deg. C to 260 deg. C. |
| Result | The device was deformed and the lead wires were displaced outward due to the thermal load. You can tell it will affect the mounting of device. |
| Keywords | Reflow,Thermal Load Analysis,Deformation,Lead Terminal,IC Package |
Fig. 1 Analysis Model
Fig. 2 Result
