| General | Option for the advance mechanical stress analysis (elasto-plastic material and fatigue life analysis) is required. Option for the accelerator is useful to reduce the analysis time. |
|---|---|
| Analysis Model | IC and surface mount components are soldered to a module substrate. The fatigue life of solder under the temperature cycle is analyzed. |
| Result | Accumulated equivalent inelastic strain amplitude becomes large at the edge of solder body. As a result, the fatigue life cycle becomes shorter. |
| キーワード | Solder,Fatigue Life Evaluation,Multi-Stage Thermal Load Analysis,Accumulated Equivalent Inelastic Strain Amplitude,Coffin–Manson Law |
