| General | Warpage of the thin film caused by the inner stress is analyzed. |
|---|---|
| Analysis Model | The inner stress of the substrate is generated by setting the initial strain for body attribute. [death] of the body attribute is applied to the substrate where the body is processed. A displacement is forcibly applied to cause the warpage of the thin film in an intended direction. After the application, the boundary condition of the forced displacement is set off. |
| Result | The results of three steps are shown. Step 1 shows the inner stress generated by the initial strain. Step 2 shows the thin film pulled away from the substrate. Step 3 shows the natural warpage after releasing the forced displacement with contour diagram. |
| Keywords | Thin Film,Compressive Stress,Residual Stress,Initial Strain,Death,PCB Processing |
