| General | Temperature distribution was compared between the module with and without a via hole for heat dissipation. |
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| Analysis Model | |
| Result | The temperature rise of the module without a via hole was within 2 deg. C. As it was within an acceptable range of temperature rise, the tool for the module was designed without a via hole, which contributed to the cost reduction. |
| Keyword | Via,Heat Dissipation,IC,PCB Design,Steady-State Heat Conduction Analysis,Mold Cost Reduction |
Temperature Distribution with Via Hole
Temperature Distribution without Via Hole
