| General | Non-steady state analysis was performed for the temperature change of the capacitor and substrate when a soldering iron was placed on them. |
|---|---|
| Analysis Model | |
| Result | You can grasp how the temperature distribution changes over time. It is also possible to perform mechanical stress-thermal coupled analysis to calculate the mechanical stress change by the temperature distribution over time. |
| Keywords | Chip Capacitor,Ceramic Capacitor,MLCC,Change in Temperature Distribution,Transient Heat Conduction Analysis |
Fig. 1 Changing Temperature
