Home / Examples / Stress Analysis [Galileo] / Example 7: Bimetal under Thermal Load

Example 7: Bimetal under Thermal Load

General

This model is a bimetal stacked with plate materials having different coefficients of linear thermal expansion. The deformation caused by thermal load from temperature variation is simulated.
The deformation, the displacement distribution, and the stress distribution are solved.
Unless specified in the list below, the default conditions will be applied.

Results will vary depending on Femtet version and the PC environment.

Analysis Space

Item	Settings
Analysis Space	3D
Model Unit	mm

Analysis Conditions

The temperature is applied evenly on the model.

Opt for the thermal load in the analysis condition, and set the reference temperature and the reached temperature.

There is no need to couple with the thermal analysis [Watt].

Item	Settings
Solver	Stress analysis [Galileo]
Analysis Type	Static Analysis
Options	Select Thermal Load.

The Step/Thermal Load tab is set as follows.

Tabs	Setting Item	Settings
Step/Thermal load	Reference Temperature	25 [deg]
Step/Thermal load	Step/Reached Temperature Setting	Step 1: 60 [deg]

Model

Create solid bodies of the box shape. As a combination of different coefficients of
linear thermal expansion, set copper and stainless (SUS410) separately.

As it deforms itself, there is no need to set up the boundary conditions to constrain.

Body Attributes and Materials

Body Number/Type	Body Attribute Name	Material Name
0/Solid	CU_PLATE	008_Cu *
1/Solid	SUS_PLATE	518_SUS410 *

* Available from the material DB

Boundary Conditions

N/A

Results

The contour diagram shows the magnitude of displacement.

As the temperature rises, copper will expand more than stainless.
The plate warps in the positive Z direction on both ends.

The vectors of the stress are shown below.

The upper plate is getting the tensile stress, whereas the lower plate is getting the compressive stress.