General
Home / Examples / Coupled Analysis / Thermal-Stress Analysis [Watt/Galileo] / Example 1: Deformation due to the Temperature Gradient #1 - Single Material
The deformation due to the temperature gradient on a singe-material cube is analyzed.
The temperature distribution is solved in the thermal analysis (Watt) and it can be treated as a reached temperature for a thermal load.
The stress is solved with the thermal load taken into account in the stress analysis (Galileo).
The deformation, the displacement distribution, and the stress distribution are solved.
Unless specified in the list below, the default conditions will be applied.
Results will vary depending on Femtet version and the PC environment.
Item |
Settings |
Analysis Space |
3D |
Model Unit |
mm |
Select Thermal analysis and Stress analysis.
Item |
Settings |
Solver |
Thermal Analysis [Watt] |
Thermal-Analysis Type |
Steady-State Analysis |
Options |
N/A * |
* [Thermal Load] is selected by default for the thermal-stress coupled analysis.
The Step/Thermal Load tab is set as follows.
Tabs |
Setting Item |
Settings |
Step/Thermal Load * |
Reference Temperature |
0 [deg] |
* The reached temperatures come from the thermal analysis.
The model is a cubic solid body. The material is the polycarbonate. The temperature is fixed at the top and bottom faces.
Body Number/Type |
Body Attribute Name |
Material Name |
0/Solid |
CUBIC |
002_Polycarbonate(PC) * |
* Available from the material DB
Thermal analysis is performed based on the boundary conditions below. The resulting temperature distribution is forwarded to stress analysis.
Boundary Condition Name/Topology |
Tab |
Boundary Condition Type |
Settings |
100degree/Face |
Thermal |
Temperature |
100 [deg] |
0degree/Face |
Thermal |
Temperature |
0 [deg] |
The temperature distribution as a result of Watt is shown below.
The next figure shows the vectors of displacement as a result of Galileo following Watt.
The expansion is larger at the top of the model.