Home / Examples / Coupled Analysis / Thermal-Stress Analysis [Watt/Galileo]
Click the example number to see the example page.
Number |
Example Title |
Simulation Image |
Setup Conditions |
Deformation due to the Temperature Gradient #1 - Single Material |
|
Static Analysis
Temperature Boundary |
|
Deformation due to the Temperature Gradient #2 - Multiple Materials 1 |
|
Static Analysis
Heating
Heat Transfer: Convection Boundary |
|
Deformation due to the Temperature Gradient #3 - Multiple Materials |
|
Static Analysis
Heating
Heat Transfer: Convection Boundary |
|
Deformation due to the Temperature Gradient #4 - Transient Analysis |
|
Transient Analysis
Temperature Boundary |
|
Temperature Dependency of Coefficient of Linear Thermal Expansion |
|
Static Analysis
Coefficient of Linear Thermal Expansion Temperature Dependency |
|
Temperature Dependency of Young's Modulus |
|
Static Analysis
Young's Modulus Temperature Dependency |
|
Model with Reflective Symmetry |
Static Analysis
Heating
Reflective Symmetry
Heat Transfer: Convection Boundary |
||
Stress Analysis of Operating IC after Soldering |
Transient Analysis |