Application83 Warpage of Thin Film after Processing Substrate

Warpage of the thin film caused by the inner stress is analyzed.

【Analysis Model】
The inner stress of the substrate is generated by setting the initial strain for body attribute.
[death] of the body attribute is applied to the substrate where the body is processed.
A displacement is forcibly applied to cause the warpage of the thin film in an intended direction.
After the application, the boundary condition of the forced displacement is set off.

The results of three steps are shown.
Step 1 shows the inner stress generated by the initial strain.
Step 2 shows the thin film pulled away from the substrate.
Step 3 shows the natural warpage after releasing the forced displacement with contour diagram.