CAE Software【Femtet】Murata Software Co., Ltd.
Temperature distribution of an object in the reflow soldering is analyzed.
In the reflow soldering, it is necessary to raise the temperature higher than the melting point of solder at the soldering point. On the other hand, it is required to suppress thermal damage on the components and substrate. So, setting a suitable temperature profile is important. By utilizing simulation, proper setting can be examined before the trial run.