Displacement Analysis of Device in the Reflow Solderingexplanation|products|Murata Software Co., Ltd.

Application18 Displacement Analysis of Device in the Reflow Soldering

A device, which consists of elements and substrate packaged with resin, was analyzed.
A thermal load analysis was conducted assuming the temperature was increased from 20 deg. C to 260 deg. C.
The device was deformed and the lead wires were displaced outward due to the thermal load. You can tell it will affect the mounting of device.

Fig. 1 Analysis Model

Fig. 2 Result