CAE Software【Femtet】Murata Software Co., Ltd.
When analyzing the stress on the solder bump in a stress analysis of a package on a substrate, if meshes are created according to the size of the solder bump, the calculation load may become large in some cases. In such a case a zooming analysis will allow high analysis accuracy without increasing the analysis load.
Fig. 1 shows an analysis model. The electronic components such as IC and LED are placed on the substrate.
The analysis steps are;
(1) Run solver.
(2) Extract the node results (csv) for zooming analysis,
(3) Edit the csv data.
(4) Create a partial model of the area for zooming analysis. Use the distributed load as a boundary condition.
As the results show, the partial model is analyzed with the finer meshes.