Application69 Analysis of Fatigue Life of Solder

Option for the advance mechanical stress analysis (elasto-plastic material and fatigue life analysis) is required.
Option for the accelerator is useful to reduce the analysis time.

【Analysis Model】
IC and surface mount components are soldered to a module substrate.
The fatigue life of solder under the temperature cycle is analyzed.

Accumulated equivalent inelastic strain amplitude becomes large at the edge of solder body. As a result, the fatigue life cycle becomes shorter.