
CAE Software【Femtet】Murata Software Co., Ltd.
【General】
Option for the advance mechanical stress analysis (elasto-plastic material and fatigue life analysis) is required.
Option for the accelerator is useful to reduce the analysis time.
【Analysis Model】
IC and surface mount components are soldered to a module substrate.
The fatigue life of solder under the temperature cycle is analyzed.
【Results】
Accumulated equivalent inelastic strain amplitude becomes large at the edge of solder body. As a result, the fatigue life cycle becomes shorter.