Application70 Bending of Module Substrate

With an option for Advanced Mechanical, the viscoelastic material is analyzed with the stress relaxation and creep deformation taken into account.
Reducing the calculation time is realized by opting for the Accelerator.

【Analysis Model】
IC and surface mount components are placed on a module substrate.
The temperature falls down to the room temperature from the reflow solder tempetrature onver the time of 300 seconds.
The bending of the substrate is analyzed.

Due to the viscoelastic characteristics of the substrate, the stiffness above the glass transition temperature is reduced and the bending quantity becomes larger than the elastic material.