Thermal Design of Via Holeexplanation|products|Murata Software Co., Ltd.

Application2 Thermal Design of Via Hole

Temperature distribution was compared between the module with and without a via hole for heat dissipation.
The temperature rise of the module without a via hole was within 2 deg. C. As it was within an acceptable range of temperature rise, the tool for the module was designed without a via hole, which contributed to the cost reduction.

Temperature Distribution with Via Hole

Temperature Distribution without Via Hole