Thermal Analysis of the Effect of Wiring Patternexplanation|products|Murata Software Co., Ltd.

Application19 Thermal Analysis of the Effect of Wiring Pattern

Heat dissipation of the IC was analyzed on the substrates with and without wiring pattern.
The maximum temperature of the board with wiring pattern is lower than without wiring pattern by 60 deg. C. It because the heat dissipates through the wiring pattern.
The heat flux shows how the heat dissipates on the board with wiring pattern.

Fig. 1 Analysis Model

Fig. 2 Result