Thermal Stress Simulation of RF Moduleexplanation|products|Murata Software Co., Ltd.

Application22 Thermal Stress Simulation of RF Module

A module is greatly bent by heat in some cases.
Simulation helps you to find the better location of the components, select proper resin, and eventually, reduce the problems in the manufacturing process.
In this analysis, the temperature profile , which is used for soldering of the components and curing of the resin, is divided to substeps.
A birth/death function is available to take into account the effect of the melted solder at high temperature and curing of the resin.

Simulation and Measurement