Application98 Thermal Load Analysis of Reflow Soldering

This example analyzes thermal load caused by a change in ambient temperature and compares results between thermal-transient-stress coupled analysis and multi-step thermal load analysis of stress solver.

Analysis Model:
The thermal-transient-stress coupled analysis takes into account the difference in temperature, between the surface and the inside of the model, caused by the ambient temperature change, and analyzes the stress thermal load. The multi-step thermal load analysis of the stress thermal load analysis assumes the temperature of the whole model changes uniformly. This example shows the difference in setting between the two analyses.

As the size of the analysis model is small, the difference in temperature inside the model is not large.
A significant difference between the results of the two analyses is not observed.