Deformation due to the Temperature Gradient #1 – Single Materialexamples|products|Murata Software Co., Ltd.

Example1 Deformation due to the Temperature Gradient #1 – Single Material

General

  • The deformation due to the temperature gradient on a singe-material cube is analyzed.
     

  • The temperature gradient caused by the heating chip is calculated by thermal analysis [Watt].
    The result is forwarded to mechanical stress analysis [Galileo] as a thermal load.
     

  • The deformation, the displacement and the mechanical stress are solved.
     

  • Unless specified in the list below, the default conditions will be applied.
     

 

Analysis Space

Item

Settings

Analysis Space

3D

Model unit

mm

 

Analysis Conditions

Select Thermal analysis and Mechanical stress analysis.

Item

Settings

Solver

Thermal analysis [Watt]
Mechanical stress analysis [Galileo]

Thermal-Analysis Type

Steady-State Analysis

Options

N/A *

* “Thermal Load” is selected by default for the thermal load-mechanical stress coupled analysis.

 

The Step/Thermal Load tab is set as follows.

Tabs

Setting Item

Settings

Step/Thermal Load *

Reference temperature

0[deg]

* The reached temperatures come from the thermal analysis.

Model

The model is a cubic solid body. The material is the polycarbonate. The temperature is fixed at the top and bottom faces.

Body Attributes and Materials

Body Number/Type

Body Attribute Name

Material Name

0/Solid

CUBIC

002_Polycarbonate(PC) *

* Available from the Material DB

Boundary Conditions

Thermal analysis is performed based on the boundary conditions below. The resulting temperature distribution is forwarded to mechanical stress analysis.

Boundary Condition Name/Topology

Tab

Boundary Condition Type

Settings

100degree/Face

Thermal

Temperature

100[deg]

0degree/Face

Thermal

Temperature

0[deg]

Results

The temperature distribution as a result of Watt is shown below.

 

The next figure shows the vectors of displacement as a result of Galileo following Watt.

The expansion is larger at the top of the model.