Example1 Deformation due to the Temperature Gradient #1 – Single Material

General

The deformation due to the temperature gradient on a singe-material cube is analyzed.
The temperature gradient caused by the heating chip is calculated by thermal analysis [Watt].
The result is forwarded to mechanical stress analysis [Galileo] as a thermal load.
The deformation, the displacement and the mechanical stress are solved.
Unless specified in the list below, the default conditions will be applied.

Analysis Space

Item	Settings
Analysis Space	3D
Model unit	mm

Analysis Conditions

Select Thermal analysis and Mechanical stress analysis.

Item	Settings
Solver	Thermal analysis [Watt] Mechanical stress analysis [Galileo]
Thermal-Analysis Type	Steady-State Analysis
Options	N/A *

* “Thermal Load” is selected by default for the thermal load-mechanical stress coupled analysis.

The Step/Thermal Load tab is set as follows.

Tabs	Setting Item	Settings
Step/Thermal Load *	Reference temperature	0[deg]

* The reached temperatures come from the thermal analysis.

Model

The model is a cubic solid body. The material is the polycarbonate. The temperature is fixed at the top and bottom faces.

Body Attributes and Materials

Body Number/Type	Body Attribute Name	Material Name
0/Solid	CUBIC	002_Polycarbonate(PC) *

* Available from the Material DB

Boundary Conditions

Thermal analysis is performed based on the boundary conditions below. The resulting temperature distribution is forwarded to mechanical stress analysis.

Boundary Condition Name/Topology	Tab	Boundary Condition Type	Settings
100degree/Face	Thermal	Temperature	100[deg]
0degree/Face	Thermal	Temperature	0[deg]

Results

The temperature distribution as a result of Watt is shown below.

The next figure shows the vectors of displacement as a result of Galileo following Watt.

The expansion is larger at the top of the model.