﻿ Deformation due to the Temperature Gradient #3 – Multiple MaterialsExamples | Product | Murata Software Co., Ltd.

# Example3Deformation due to the Temperature Gradient #3 – Multiple Materials

General

• A heating chip is mounted on a substrate. The temperature gradient caused by the heating chip is calculated by thermal analysis [Watt]. This is the same as Exercise 10 of thermal analysis.
Then, the deformation due to the temperature gradient is solved by Galileo (mechanical stress analysis).

• The temperature gradient caused by the heating chip is calculated by Watt
The result is forwarded to Galileo as a thermal load.

• The deformation, the displacement and the mechanical stress are solved.

• Unless specified in the list below, the default conditions will be applied.

### Analysis Space

 Item Settings Analysis Space 3D Model unit mm

### Analysis Conditions

Select Thermal analysis and Mechanical stress analysis.

 Item Settings Solvers Thermal analysis [Watt] Mechanical stress analysis [Galileo] Thermal-Analysis Type Steady-State Analysis Options N/A *

* “Thermal Load” is selected by default for the thermal load-mechanical stress coupled analysis.

The Step/Thermal Load tab is set as follows.

 Tab Setting Item Settings Step/Thermal Load * Reference temperature 25[deg]

* The reached temperatures come from the thermal analysis.

### Model

The same as Exercise 10 of thermal analysis.

### Body Attributes and Materials

 Body Number/Type Body Attribute Name Material Name 0/Solid SUB 006_Glass_epoxy * 1/Solid GND 008_Cu * 2/Solid MAINCHIP 001_Alumina * 3/Solid SUBCHIP 001_Alumina * 4/Solid HOLE 008_Cu * 5/Solid HOLE 008_Cu * 6/Solid HOLE 008_Cu * 7/Solid HOLE 008_Cu * 8/Solid HOLE 008_Cu * 9/Solid HOLE 008_Cu * 10/Solid HOLE 008_Cu * 11/Solid HOLE 008_Cu *

* Available from the Material DB

The heat sources of MAINCHIP and SUBCHIP are set up as follows.

 Body Attribute Name Tab Settings MAINCHIP Heat Source 0.2[W] SUBCHIP Heat Source 0.1[W]

### Boundary Conditions

The heat transfer coefficient for the natural convection is set on the bottom face of GND as follows:

The radiation from the top and the sides is omitted.

 Boundary Condition Name/Topology Tab Boundary Condition Type Settings Bottom/Face Thermal Heat Transfer/Ambient Radiation Natural convection*: 1.39[W/m2/deg5/4] Room Temperature : 25[deg]

* The coefficient for the natural convection is calculated as follows. See [Heat Transfer/Ambient Radiation] for more information.

2.51×C×（1/L)＾（1/4） = 1.39 [W/m2/deg5/4]

where

C = 0.26

Size of the substrate : 0.06×0.04

L (Typical Length) = (0.06 x 0.04 x 2) / (0.06 + 0.04) = 0.048

### Results

The temperature distribution as a result of Watt is shown below.

The next figure shows the vectors of displacement as a result of Galileo following Watt.

The substrate corners which shows the low temperature are bent downward.

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