Electroplating(Hull Cell Test Bath)examples|products|Murata Software Co., Ltd.

Example8 Electroplating(Hull Cell Test Bath)

General

  • The electric field in the electroplating solution is analyzed.

  • The overvoltage at anode and cathode is taken into account.
    The current density in the bath and the distribution of plating thickness are solved.

  • Unless specified in the list below, the default conditions will be applied.

 

Analysis Space

Item

Settings

Analysis Space

3D

Model unit

mm

 

Analysis Conditions

The material is conductor for the plating analysis.

Select the [Perform the plating analysis] option.

Item

Settings

Solvers

Electric Field Analysis [Coulomb]

Analysis Type

Static analysis

Materials

Conductor

Options

Select Perform the plating analysis
Select Calculate the plating thickness
Plating time: 300 [s]

 

Graphical Objects

The plating bath (Hull cell bath) is a solid body. The material is the plating solution.

The electrodes are set with the plating wall boundary condition.

Body Attributes and Materials

The plating bath (Hull cell bath) is a solid body. The material is the plating solution.

Body Number/Type

Body Attribute Name

Material Name

0/Solid

Cell

Plating Solution

 

The body attribute of the plating solution is set as follows.

Body Attribute Name

Plating Tab

Cell

Type of Plating Body: Plating Solution

 

The conductivity of the plating solution is set as follows.

Material Name

Conductivity Tab

Plating Solution

Conductivity Type: Conductor

Conductivity: 10 [S/m]

Boundary Condition

The boundary conditions are set as follows.

Boundary Condition Name/Topology

Tab

Boundary Condition Type

Settings

Cathode/Face

Electric

Plating wall

Electrode Setting: Cathode

Extracted Metal Setting

Conductivity

50×106 [S/m]

Electrochemical equivalent

100×10-9 [kg/(As)]

Density

10×103 [kg/m3]

Extraction efficiency

1.0×100

 

Overvoltage Type: Tafel’s Law

a1[V]

5.0×10-2

a2[Vm2/A]

1.0×10-1

Anode/Face

Electric

Plating wall

Electrode Setting: Anode

 

Overvoltage Type: Linear

a1[V]

0.0

a2[Vm2/A]

5.0×10-5

 

Plating Condition: Current: 1.0[A]

 

  • In this Exercise, Current is selected for the plating condition of the plating wall to perform analysis with specified current of the anode.
    To perform analysis with specified voltage of the anode, select Voltage for the plating condition.
    Calculations of the voltage-specified analysis is less than that of current-specified analysis, and the analysis time will be shorter.

Results

The current density vector is shown in Figure 1 below.
The current density distribution typical of the test bath is observed around the cathode.


Figure 1 The current density vector

 

By using the drawing feature of Femtet, show the plating thickness extracted on the cathode.
Figure 2 shows the plating thickness along the cathode from the start point at the right bottom up to the right top.
Plating thickness is distributed according to the current density.

Figure 2 Distribution of the plating thickness

 

  • Refer to Field Graph for the detail of graph drawing.

 

 

(*) “Hull cell” is a product of YAMAMOTO-MS Co., Ltd.